The team at COMOS Technology has developed a new generation MOS IP Platform based on the advantages of planar MOS and vertical MOS architectures. It features high frequency, high density, and full compatibility with CMOS processes. Providing better single‑chip design options for BCD processes, with the aim of helping customers develop single chips that combine low power consumption, high efficiency, and compact size.
With the AI market continuing to grow robustly, applications are expanding from AI servers and on‑premise deployments to practical AI in robotics and electric vehicles, driving an essential need for power solutions that are highly efficient, precise, and reliable.
COMOS Technology provides proprietary MOS processes and MOS IP to foundries, IDMs, and IC design houses, positioning itself as a strong choice for customers developing power chips near the computing core and diverse consumer SOCs.
Committed to independent innovation, the company consistently delivers next‑generation standard and customized MOS IP, aiming to collaborate with customers in creating groundbreaking SOC products.
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