MOS IP & Power Semiconductor Tech Platform
BCUD Process & Custom MOS IP Services
COMPANY PROFILE
ABOUTCOMOS
Leveraging the advantages of MOS architecture to develop a next-generation chip design platform.
The COMOS Technology team integrates the strengths of planar and vertical MOS architectures to develop a next-generation MOS IP Platform. Featuring high frequency, high density, and CMOS process compatibility, it offers greater flexibility for single-chip design in BCD process—enabling customers products to achieve lower power consumption, higher efficiency, and smaller footprints.
High-Frequency PerformanceMeets power IC design needs near the computing core
High-Density IntegrationSupports single-chip & integrated power device designs
CMOS CompatibilityProvides high-voltage processes & custom MOS IP options
Serving Foundries, IDMs, and IC Design Companies
MoreCORE TECHNOLOGY
CORE TECHNOLOGY
Centered on BCUD process technology and MOS IP, combined with Ultra MOS features—high frequency, high density, and CMOS compatibility—we expand next-generation power device and single-chip design applications.
